EMS solusan fun tejede Circuit Board
Apejuwe
Ni ipese pẹlu SPI, AOI, ati ẹrọ X-ray fun awọn laini 20 SMT, 8 DIP, ati awọn laini idanwo, a funni ni iṣẹ ilọsiwaju ti o ni ọpọlọpọ awọn ilana apejọ ati ṣe agbejade PCBA-pupọ, PCBA rọ.Yàrá ọjọgbọn wa ni ROHS, silẹ, ESD, ati giga & awọn ẹrọ idanwo iwọn otutu kekere.Gbogbo awọn ọja ni a gbejade nipasẹ iṣakoso didara to muna.Lilo eto MES ti ilọsiwaju fun iṣakoso iṣelọpọ labẹ boṣewa IAF 16949, a mu iṣelọpọ ni imunadoko ati ni aabo.
Nipa apapọ awọn orisun ati awọn onimọ-ẹrọ, a tun le funni ni awọn solusan eto, lati idagbasoke eto IC ati sọfitiwia si apẹrẹ Circuit itanna.Pẹlu iriri ni idagbasoke awọn iṣẹ akanṣe ni ilera ati ẹrọ itanna onibara, a le gba awọn imọran rẹ ki o mu ọja gangan wa si igbesi aye.Nipa idagbasoke sọfitiwia, eto, ati igbimọ funrararẹ, a le ṣakoso gbogbo ilana iṣelọpọ fun igbimọ, ati awọn ọja ikẹhin.Ṣeun si ile-iṣẹ PCB wa ati awọn onimọ-ẹrọ, o pese wa pẹlu awọn anfani ifigagbaga ni akawe si ile-iṣẹ lasan.Da lori apẹrẹ ọja & ẹgbẹ idagbasoke, ọna iṣelọpọ ti iṣeto ti awọn titobi oriṣiriṣi, ati ibaraẹnisọrọ to munadoko laarin pq ipese, a ni igboya lati koju awọn italaya ati gba iṣẹ naa.
| PCBA Agbara | |
| Laifọwọyi ẹrọ | Apejuwe |
| Lesa siṣamisi ẹrọ PCB500 | Iwọn ami si: 400 * 400mm |
| Iyara: ≤7000mm/S | |
| Agbara to pọju: 120W | |
| Q-iyipada, Ipin Ojuse: 0-25KHZ;0-60% | |
| Titẹ sita ẹrọ DSP-1008 | Iwọn PCB: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Iwọn Stencil: Max: 737*737mm MIN: 420 * 520mm | |
| Scraper titẹ: 0.5 ~ 10Kgf / cm2 | |
| Ọna mimọ: mimọ gbigbẹ, mimọ tutu, mimọ igbale (ti ṣe eto) | |
| Iyara titẹ sita: 6 ~ 200mm / iṣẹju-aaya | |
| Titẹ sita deede: ± 0.025mm | |
| SPI | Ilana wiwọn: 3D White Light PSLM PMP |
| Nkan wiwọn: iwọn didun lẹẹ tita, agbegbe, iga, aiṣedeede XY, apẹrẹ | |
| Ipinnu lẹnsi: 18um | |
| Itọkasi: XY ipinnu: 1um; Iyara giga: 0.37um | |
| Iwọn wiwo: 40 * 40mm | |
| FOV iyara: 0.45s/FOV | |
| Ga iyara SMT ẹrọ SM471 | Iwọn PCB: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Nọmba ti iṣagbesori awọn ọpa: 10 spindles x 2 cantilever | |
| Iwọn paati: Chip 0402 (01005 inch) ~ □ 14mm(H12mm) IC, Asopọ ( ipolowo asiwaju 0.4mm), ※ BGA, CSP(Tin ball spacing 0.4mm) | |
| Iṣagbesori deede: ërún ± 50um@3ó/chip, QFP ± 30um@3ó/chip | |
| Iṣagbesori iyara: 75000 CPH | |
| Ga iyara SMT ẹrọ SM482 | Iwọn PCB: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Nọmba ti iṣagbesori awọn ọpa: 10 spindles x 1 cantilever | |
| Iwọn paati: 0402 (01005 inch) ~ □ 16mm IC, Asopọ ( ipolowo asiwaju 0.4mm), ※ BGA, CSP (Alafo Bọọlu Tin 0.4mm) | |
| Iṣagbesori išedede: ± 50μm@μ+3σ (gẹgẹ bi iwọn chirún boṣewa) | |
| Iṣagbesori iyara: 28000 CPH | |
| HELLER MARK III Nitrogen reflux ileru | Agbegbe: Awọn agbegbe alapapo 9, awọn agbegbe itutu agbaiye 2 |
| Ooru orisun: Gbona air convection | |
| Ilana iṣakoso iwọn otutu: ± 1 ℃ | |
| Agbara isanpada gbona: ± 2℃ | |
| Iyara Yiyi: 180-1800mm / min | |
| Iwọn iwọn orin: 50-460mm | |
| AOI ALD-7727D | Ilana wiwọn: Kamẹra HD gba ipo iṣaro ti apakan kọọkan ti itanna awọ mẹta ti itanna lori igbimọ PCB, ati ṣe idajọ rẹ nipa ibaamu aworan tabi iṣẹ ọgbọn ti grẹy ati awọn iye RGB ti aaye ẹbun kọọkan. |
| Ohun kan wiwọn: Solder lẹẹ awọn abawọn titẹ sita, awọn abawọn apakan, awọn abawọn apapọ solder | |
| Ipinnu lẹnsi: 10um | |
| Itọkasi: ipinnu XY: ≤8um | |
| 3D X-RAY AX8200MAX | Iwọn wiwa ti o pọju: 235mm*385mm |
| Agbara to pọju: 8W | |
| O pọju foliteji: 90KV / 100KV | |
| Iwọn idojukọ: 5μm | |
| Aabo (iwọn lilo redio): 1uSv/h | |
| Igbi soldering DS-250 | PCB iwọn: 50-250mm |
| PCB gbigbe iga: 750 ± 20 mm | |
| Iyara gbigbe: 0-2000mm | |
| Gigun ti agbegbe alapapo: 0.8M | |
| Nọmba agbegbe alagbona: 2 | |
| Nọmba igbi: Igbi meji | |
| Board splitter ẹrọ | Iwọn iṣẹ: Max: 285 * 340mm MIN: 50 * 50mm |
| Gige konge: ± 0.10mm | |
| Iyara gige: 0 ~ 100mm/S | |
| Iyara ti yiyi ti spindle: Max:40000rpm | |
| Agbara Imọ-ẹrọ | ||
| Nọmba | Nkan | Agbara nla |
| 1 | ipilẹ ohun elo | Deede Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk / Df ati be be lo. |
| 2 | Solder boju awọ | alawọ ewe, pupa, bulu, funfun, ofeefee, eleyi ti, dudu |
| 3 | Awọ arosọ | funfun, ofeefee, dudu, pupa |
| 4 | Dada itọju iru | ENIG, Tin Immersion, HAF, HAF LF, OSP, goolu filasi, ika goolu, fadaka nla |
| 5 | O pọju.ipele-soke (L) | 50 |
| 6 | O pọju.iwọn ẹyọkan (mm) | 620*813 (24"*32") |
| 7 | O pọju.Iwọn nronu iṣẹ (mm) | 620*900 (24"x35.4") |
| 8 | O pọju.sisanra igbimọ (mm) | 12 |
| 9 | Min.sisanra igbimọ (mm) | 0.3 |
| 10 | Ifarada sisanra igbimọ (mm) | T<1.0 mm: +/-0.10mm;T≥1.00mm: +/- 10% |
| 11 | Ifarada iforukọsilẹ (mm) | +/- 0.10 |
| 12 | Min.iwọn ila opin iho ẹrọ (mm) | 0.15 |
| 13 | Min.Iwọn iho liluho lesa (mm) | 0.075 |
| 14 | O pọju.aspect (nipasẹ iho) | 15:1 |
| O pọju.abala (micro-nipasẹ) | 1.3:1 | |
| 15 | Min.eti iho si aaye bàbà (mm) | L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2；L=36-44, 0.25；L＞44, 0.3 |
| 16 | Min.imukuro inu (mm) | 0.15 |
| 17 | Min.eti iho si aaye eti iho (mm) | 0.28 |
| 18 | Min.eti iho si aaye laini profaili (mm) | 0.2 |
| 19 | Min.Ejò innerlay si sapce laini profaili (mm) | 0.2 |
| 20 | Iforukọsilẹ laarin awọn iho (mm) | ±0.05 |
| 21 | O pọju.sisanra bàbà ti pari (um) | Layer ita: 420 (12oz) Layer inu: 210 (6oz) |
| 22 | Min.ibú wa kakiri (mm) | 0.075 (milionu mẹta) |
| 23 | Min.aaye wa kakiri (mm) | 0.075 (milionu mẹta) |
| 24 | sisanra boju-boju solder (um) | igun ila:> 8 (0.3mil) lori bàbà:> 10 (0.4mil) |
| 25 | sisanra goolu ENIG (um) | 0.025-0.125 |
| 26 | ENIG nickle sisanra (um) | 3-9 |
| 27 | sisanra fadaka Sterling (um) | 0.15-0.75 |
| 28 | Min.Iwọn tin HAL (um) | 0.75 |
| 29 | sisanra tin immersion (um) | 0.8-1.2 |
| 30 | Isanra goolu ti o nipọn (um) | 1.27-2.0 |
| 31 | sisanra goolu ika ika goolu (um) | 0.025-1.51 |
| 32 | sisanra ika goolu (um) | 3-15 |
| 33 | sisanra goolu filasi (um) | 0,025-0.05 |
| 34 | sisanra goolu filasi nickle (um) | 3-15 |
| 35 | ifarada iwọn profaili (mm) | ±0.08 |
| 36 | O pọju.boju-boju solder iwọn iho pilogi (mm) | 0.7 |
| 37 | BGA paadi (mm) | ≥0.25 (HAL tabi HAL Ọfẹ: 0.35) |
| 38 | Ifarada ipo abẹfẹlẹ V-CUT (mm) | +/- 0.10 |
| 39 | Ifarada ipo V-CUT (mm) | +/- 0.10 |
| 40 | Ifarada igun bevel ika goolu (o) | +/-5 |
| 41 | Ifarada ikọsẹ (%) | +/- 5% |
| 42 | Ifarada oju-iwe ogun (%) | 0.75% |
| 43 | Min.ibú arosọ (mm) | 0.1 |
| 44 | Iná iná calss | 94V-0 |
| Pataki fun Nipasẹ ni awọn ọja paadi | Iwon iho edidi ti Resini (min.) (mm) | 0.3 |
| Iwọn iho edidi ti o pọ julọ (o pọju) (mm) | 0.75 | |
| Isanra pákó tí a so mọ́ Resini (min.) (mm) | 0.5 | |
| Isanra pákó tí a so mọ́ Resini (max.) (mm) | 3.5 | |
| Resini edidi o pọju ipin ipin | 8:1 | |
| Resini edidi iho ti o kere ju si aaye iho (mm) | 0.4 | |
| Le iwọn iho iyato ninu ọkan ọkọ? | beeni | |
| Pada ọkọ ofurufu | Nkan | |
| O pọju.Iwọn pnl (ti pari) (mm) | 580*880 | |
| O pọju.Iwọn nronu iṣẹ (mm) | 914 × 620 | |
| O pọju.sisanra igbimọ (mm) | 12 | |
| O pọju.ipele-soke (L) | 60 | |
| Abala | 30:1 (Iho min: 0.4 mm) | |
| Laini fife/aaye (mm) | 0.075 / 0.075 | |
| Back lu agbara | Bẹẹni | |
| Ifarada ti liluho sẹhin (mm) | ±0.05 | |
| Ifarada ti awọn ihò fit titẹ (mm) | ±0.05 | |
| Dada itọju iru | OSP, fadaka, ENIG | |
| Kosemi-Flex ọkọ | Iwọn iho (mm) | 0.2 |
| Dielectrical sisanra (mm) | 0.025 | |
| Iwọn igbimọ iṣẹ (mm) | 350 x 500 | |
| Laini fife/aaye (mm) | 0.075 / 0.075 | |
| Digidi | Bẹẹni | |
| Awọn ipele igbimọ Flex (L) | 8 (4plys ti igbimọ flex) | |
| Awọn ipele igbimọ lile (L) | ≥14 | |
| Dada itọju | Gbogbo | |
| Flex ọkọ ni aarin tabi lode Layer | Mejeeji | |
| Pataki fun HDI awọn ọja | Iwọn iho liluho lesa (mm) | 0.075 |
| O pọju.sisanra dielectric (mm) | 0.15 | |
| Min.sisanra dielectric (mm) | 0.05 | |
| O pọju.Abala | 1.5:1 | |
| Iwọn paadi isalẹ (labẹ micro-via) (mm) | Iho iwọn + 0,15 | |
| Iwọn paadi ẹgbẹ oke (lori micro-nipasẹ) (mm) | Iho iwọn + 0,15 | |
| Nkún Ejò tabi rara (bẹẹni tabi rara) (mm) | beeni | |
| Nipasẹ apẹrẹ paadi tabi rara (bẹẹni tabi rara) | beeni | |
| Resini iho ti a so pọ (bẹẹni tabi rara) | beeni | |
| Min.nipasẹ iwọn le jẹ Ejò kun (mm) | 0.1 | |
| O pọju.igba akopọ | eyikeyi Layer | |